Conference
Device Packaging Conference 2026
- March 3rd-5th, 2026
- Phoenix, Arizona
Schrödinger is excited to be participating in the Device Packaging Conference 2026 taking place on March 2nd – 5th in Phoenix, Arizona. Join us for a presentation on March 5th, at 11:00am by David Nicholson, Principal Scientist I at Schrödinger, titled “Predicting the Thermomechanical and Adhesive Properties of a Layered Polyimide Packaging Material Using Molecular Simulations .” Stop by booth #404 to speak with Schrödinger scientists.