Device Packaging Conference 2026
Date & Time - March 3rd-5th, 2026
Location - Phoenix, Arizona
Schrödinger is excited to be participating in the Device Packaging Conference 2026 taking place on March 2nd – 5th in Phoenix, Arizona. Join us for a presentation on by David Nicholson, Principal Scientist I at Schrödinger, titled “Predicting the Thermomechanical and Adhesive Properties of a Layered Polyimide Packaging Material Using Molecular Simulations.” Stop by booth #404 to speak with Schrödinger scientists.
MAR 5 | 11:00AM Predicting the Thermomechanical and Adhesive Properties of a Layered Polyimide Packaging Material Using Molecular Simulations
Speaker:
David Nicholson, Principal Scientist I, Schrödinger
Abstract:
This study evaluates the thermomechanical and adhesive properties of a photo-imageable dielectric (PID) polyimide and reference Kapton (PMDA-ODA) using atomistic simulations. Molecular dynamics (MD) with the OPLS4 force field was employed to predict the glass transition temperature, coefficients of thermal expansion (CTE), and elastic moduli, showing strong agreement with experimental benchmarks for bulk properties. Interfacial simulations of PMDA-ODA and Upilex (BPDA-PPD) on bare Cu(111) revealed delamination failure at strains of 0.03. BPDA-PPD showed slightly stronger strength under strain, in agreement with experimental trends for similar interfaces.